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Xilinx Announcement Heralds Era of Silicon Interposers

机译:Xilinx公告宣布了硅中介层时代

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With Xilinx's (xilinx.com) announcement of the first shipments of its Virtex-7 2000T Field Programmable Gate Array (FPGA), the era of 2.5D has begun.Xilinx reports that the 2000T is the world's highest-capacity FPGA using 6.8 billion transistors, providing customers access to an unprecedented 2 million logic cells, equivalent to 20 million ASIC gates for system integration, ASIC replacement, and ASIC prototyping and emulation.Co-design with packaging technology has created a new FPGA that reduces system cost and increases performance with lower power. By not having to drive off-chip 1/ Os across PCB traces to adjacent FPGAs, designers for high-performance applications that have previously used multiple FPGAs in their systems will be able to benefit from the high-bandwidth, low-latency, power-efficient interconnect between the FPGA die.The key to the performance gains is the silicon interposer or what Xilinx calls its "Stacked Silicon Interconnect" technology.
机译:随着Xilinx(xilinx.com)宣布其第一批Virtex-7 2000T现场可编程门阵列(FPGA),Xilinx报告称2000T是使用68亿个晶体管的世界上容量最大的FPGA为客户提供前所未有的200万个逻辑单元的访问权限,相当于2000万个ASIC门用于系统集成,ASIC替换以及ASIC原型设计和仿真。协同设计与封装技术共同创造了一种新型FPGA,可降低系统成本并提高性能较低的功率。通过不必跨PCB走线将片外1 / O驱动到相邻的FPGA,以前在其系统中使用多个FPGA的高性能应用的设计人员将能够从高带宽,低延迟,低功耗的电源中受益。 FPGA裸片之间的高效互连。性能提升的关键是硅中介层或Xilinx所谓的“堆叠硅互连”技术。

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