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Super Small VIA-IN-PAD

机译:超小型VIA-IN-PAD

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摘要

Via-in-pad is an old issue that still pops up far too often. Our standard answer hasn't changed: no open vias in pads. But one of the questions we get related to the subject is: What if we make the vias really small? Logically, that makes sense. In fact, in some cases, the via is so small that it's essentially closed. If it's so small that it really is closed, then it's not an open via. But look close: If it's closed with solder, that solder may melt during reflow, leading to an open via. Small vias on HASL finished boards (leaded or lead-free) often look closed, but will melt through in the reflow oven.
机译:Pad-in-pad是一个老问题,仍然经常弹出。我们的标准答案没有改变:焊盘中没有开放的过孔。但是,与该主题相关的问题之一是:如果我们将通孔做得很小,该怎么办?从逻辑上讲,这是有道理的。实际上,在某些情况下,通孔非常小,以至于基本上是封闭的。如果它很小以至于实际上是封闭的,则它不是开放的通孔。但请注意:如果用焊料封闭,则焊料可能在回流期间熔化,从而导致通孔打开。 HASL成品板上的小通孔(有铅或无铅)通常看起来很封闭,​​但会在回流焊炉中融化。

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