On the Road to 3D IC

摘要

Orlando in may hosted the 64rd Electronics Components and Technology Conference (ECTC), where more than 1,000 attendees from 33 countries gathered to discuss recent developments in semiconductor packaging, assembly, materials and manufacturing. While many presentations reported progress along the road to 3D IC manufacturing with through silicon vias (TSVs), the holy grail of stacking dies with different functions remained as elusive as Piglet - a shy creature who rarely makes an appearance in Disney's Magic Kingdom theme park. The need for 3D ICs remains constant, as companies ponder the cost of lithography at silicon technology nodes of 10nm and below.