The IEEE 1149.1 standard, commonly known as boundary scan, is a well-adopted electronics manufacturing test strategy used throughout the life-cycle of a printed circuit board assembly - from prototypes, new product introduction builds, production runs and functional tests, to field repair. It is a low cost, yet effective tool for capturing structural defects during manufacturing. While boundary scan is widely adopted, challenges are bound to happen during the implementation phase that will frustrate test and design engineers. These challenges can crop up in various situations: for example, during boundary scan implementation on IC devices, wrong boundary scan description language (BSDL) declaration that does not match the actual device, poorly designed PCBA test for boundary scan, or during implementation of the various boundary scan tools and integration to other manufacturing test strategies.
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