Stencil printing is an efficient and effective way of applying millions of well-controlled solder paste deposits, but it is not without its limitations. Many packages, such as area array and bottom termination components, keep getting smaller, while connectors, shields and other big components remain the same size or grow even larger. Pushing the limits of stencil printing on either or both ends of the printable size spectrum can present considerable challenges for PCB assemblers. One way to conquer these challenges is to dispense solder paste. Dispensing is an attractive option because it permits infinite flexibility. It can produce very small deposits or large deposits, and it is fully compatible with the existing SMT process and materials. In fact, many printable solder pastes have dispensable versions that use the same flux to ensure reliability.
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