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Return Vias, Buildup Layers and the Latest FPGAs

机译:返回过孔,构建层和最新的FPGA

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WHERE SIGNALS NEED return vias, component vendors often do most of the work. Let's look at a PCI Express differential pair, starting with a standard connector, showing its pinout but not its body. (I'll cover the connector body in a moment.) The signal pin assignments are also standardized. FIGURE 1 shows a through-pin component. The two sides of the differential pair (marked P and N) are close to ground pins. There's some differential coupling between the P and N pins, and the ground pins create returns in the Z dimension, just like ground planes do for traces.
机译:在需要返回通孔的信号时,组件供应商通常会完成大部分工作。让我们看一下从标准连接器开始的PCI Express差分对,显示其引脚排列,但不显示其主体。 (稍后我将介绍连接器主体。)信号针的分配也已标准化。图1显示了一个通针组件。差分对的两侧(标记为P和N)靠近接地引脚。 P和N引脚之间存在一些差分耦合,并且接地引脚会在Z维度上形成回路,就像走线的接地层一样。

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