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The Basics of Manufacturing Printed Circuit Boards

机译:制造印刷电路板的基础

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PRINTED CIRCUIT BOARDS are produced in different forms, e.g., rigid, flexible, rigid-flex, and high-density interconnect (HDI). The primary differences are in the materials used to fabricate them; these materials, by their properties, give PCBs their ability to flex or to remain rigid. Regardless of the materials used, the primary steps in the PCB manufacturing process are generally the same. But before PCBs reach the manufacturing stage, the PCB designer must make some choices depending on the application: 1. Selecting the type of PCB required by the application; 2. Deciding the number of layers (one, two, four or more); 3. Deciding the mechanical layout, the stackup, and the routing of tracks on different layers; 4. Producing relevant documents and files for the manufacturing process.
机译:印刷电路板以不同的形式生产,例如,刚性,柔性,刚性-柔性和高密度互连(HDI)。主要区别在于用于制造它们的材料。这些材料通过其特性使PCB具有弯曲或保持刚性的能力。无论使用哪种材料,PCB制造过程中的主要步骤通常都是相同的。但是在PCB进入制造阶段之前,PCB设计者必须根据应用进行一些选择:1.选择应用所需的PCB类型; 2.确定层数(一层,两层,四层或更多层); 3.确定不同层上的机械布局,堆叠和走线路线; 4.为生产过程生产相关的文件和档案。

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