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Direct determination of bulk etching rate for LR-115-II solid state nuclear track detectors

机译:直接确定LR-115-II固态核径迹探测器的整体蚀刻速率

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摘要

The thickness of the removed layer of the LR-115-II solid state nuclear track detector during etching is measured directly with a rather precise instrument. Dependence of bulk etching rate on temperature of the etching solution is investigated. It has been found that the bulk etching rate is 3.2 μm/h at 60℃ in 2.5 N NaOH of water solution. It is also found that the track density in detectors exposed to soil samples increases linearly with the removed layer.
机译:在蚀刻过程中,LR-115-II固态核径迹检测器的去除层厚度直接用相当精密的仪器测量。研究了整体蚀刻速率对蚀刻溶液温度的依赖性。已经发现,在2.5N NaOH水溶液中,在60℃下的整体蚀刻速率为3.2μm/ h。还发现暴露于土壤样品的检测器中的轨道密度随去除的层线性增加。

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