Epoxy resins cured with aminophenylmentylphos0hine oxide-II Mechanism of thermal decomposition

摘要

The thermal decomposition behaviour of the mixed epoxy resin, tetraglycidyl 4,4'-diaminodiphenylmentane (TGDDM) and diglycidylether of bisphenol A (DGEBA), in a 1:1 ration, cured with 3,3',5,5'-tetraethyl-4,4'-diaminodiphe- nylmethane (M-DEA) or bis(m-aminophenyl)methylphosphine oxide (BAMPO) or with mixtures of the hardeners was studied. On heating, the resins rapidly decompose above 290 deg.C in an exothermic process involving dehydration, bond scissiona and chain fragment volatilisation. However, as the temperature increases, unsaturations created in the bond scission process polymerise to give a residue which, above 400 deg.C, undergoes aromatisation to form a thermostable 'char'.