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Effects of pH on Bacterial Inactivation in Aqueous Solutions due to Low-Temperature Atmospheric Pressure Plasma Application

机译:pH对低温大气压等离子体施加导致水溶液中细菌失活的影响

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摘要

Low-temperature atmospheric pressure plasmas applied to the surface of an aqueous solution have been shown to be efficient bactericides for bacteria suspended in the solution, if the solution is sufficiently acidic. Especially of interest is the finding that there is a critical pH value of about 4.7 for the bactericidal effects, below which the bacteria are efficiently inactivated and above which the bacteria are hardly affected by the plasma application. It has been also found that the presence of superoxide anion radicals O_2~- • in the solution is essential for bacterial inactivation by the plasma application. Therefore, the critical pH value may arise from the pK_a of the equilibrium reaction between O_2~- • and hydroperoxy radicals HOO•, which is known to be approximately 4.8. The present experiments, where plasmas are not directly applied to bacterium surfaces and it has been confirmed that neither UV light nor heat from the plasma is the cause of bacterial inactivation, suggest the importance of highly reactive species generated in the solution via plasma-liquid interaction for the bactericidal effects.
机译:如果溶液足够酸,施加到水溶液表面的低温大气压等离子体已被证明是悬浮在溶液中的细菌的有效杀菌剂。特别令人感兴趣的发现是对于杀菌作用存在临界pH值约为4.7,低于该pH值细菌被有效地灭活,并且高于该pH值细菌几乎不受血浆施加的影响。还已经发现,溶液中超氧化物阴离子自由基O_2〜-•的存在对于通过等离子体施加使细菌失活是必不可少的。因此,临界pH值可能由O_2〜-•与氢过氧自由基HOO•之间的平衡反应的pK_a引起,已知约为4.8。当前的实验中,血浆没有直接施加到细菌表面,并且已经确认,血浆中的紫外线和热量都不是细菌灭活的原因,这表明通过血浆-液体相互作用在溶液中产生高反应性物质的重要性具有杀菌作用。

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  • 来源
    《Plasma processes and polymers》 |2010年第1期|33-42|共10页
  • 作者单位

    Technology Research Institute of Osaka Prefecture 2-7-1 Ayumino, Izumi, Osaka 594-1157, Japan;

    Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

    Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;

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