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Defect levels of dangling bonds in silicon and germanium through hybrid functionals

机译:通过混合功能实现硅和锗中悬挂键的缺陷水平

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摘要

Defect levels of dangling bonds in silicon and germanium are determined within their respective band gaps through the use of hybrid density functionals. To validate our approach, we first considered the dangling bond in silicon finding two well-separated defect levels in excellent correspondence with their experimental location. Application to the dangling bond in germanium then yields two very close defect levels lying just above the valence band, which is consistent with the experimental location of the charge neutrality level. The occurrence of negative- U behavior leads to a reduced fraction of neutral dangling bonds, thereby suppressing the electron-spin-resonance activity.
机译:硅和锗中的悬挂键的缺陷水平是通过使用混合密度泛函确定的,它们各自的带隙内。为了验证我们的方法,我们首先考虑了硅中的悬空键,发现两个分离得很好的缺陷水平与它们的实验位置极为吻合。然后,将其施加到锗的悬空键上,会产生两个非常接近的缺陷能级,恰好在价带上方,这与电荷中性能级的实验位置一致。负U行为的出现导致中性悬挂键分数降低,从而抑制了电子自旋共振活性。

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