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Schottky barriers at hexagonal boron nitride/metal interfaces: A first-principles study

机译:六方氮化硼/金属界面的肖特基势垒:第一性原理研究

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摘要

The formation of a Schottky barrier at the interface between a metal and hexagonal boron nitride (h-BN) is studied using density functional theory. For metals whose work functions range from 4.2 to 6.0 eV, we find Schottky barrier heights for holes between 1.2 and 2.3 eV. A central role in determining the Schottky barrier height is played by a potential step of between 0.4 and 1.8 eV that is formed at the metal|h-BN interface and effectively lowers the metal work function. If h-BN is physisorbed, as is the case on fcc Cu, Al, Au, Ag, and Pt(111) substrates, the interface potential step is described well by a universal function that depends only on the distance separating h-BN from the metal surface. The interface potential step is largest when h-BN is chemisorbed, which is the case for hcp Co and Ti (0001) and for fcc Ni and Pd (111) substrates.
机译:使用密度泛函理论研究了在金属和六方氮化硼(h-BN)之间的界面处肖特基势垒的形成。对于功函范围为4.2至6.0 eV的金属,我们发现孔的肖特基势垒高度为1.2至2.3 eV。确定肖特基势垒高度的中心作用是在h-BN界面上形成的0.4至1.8 eV之间的电位阶跃,从而有效地降低金属功函数。如果h-BN被物理吸附,就像在fcc Cu,Al,Au,Ag和Pt(111)衬底上那样,界面电势阶跃通过通用函数很好地描述,该通用函数仅取决于h-BN与金属表面。当h-BN被化学吸附时,界面电位阶跃最大,对于hcp Co和Ti(0001)以及fcc Ni和Pd(111)衬底就是这种情况。

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