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首页> 外文期刊>Physica status solidi (a) Applications and materials science >Thermal and Damp Heat Stability of High-Mobility In_2O_3-Based Transparent Conducting Films Fabricated at Low Process Temperatures
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Thermal and Damp Heat Stability of High-Mobility In_2O_3-Based Transparent Conducting Films Fabricated at Low Process Temperatures

机译:高迁移率的热和潮湿热稳定性在低工艺温度下制造的基于渗透膜的高迁移率In_2O_3的透明导电薄膜

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摘要

High electron mobility of transparent conductive oxide (TCO) facilitates highconductivity at a moderate carrier density, resulting in an extension of the degreeof transparency from visible to near-infrared due to less free carrier absorption.These broadband TCO electrodes provide opportunities to improve the performanceof optoelectronic devices. Herein, the thermal and damp heat stabilitycharacteristics of TCO films are described. It is found that the difference in thecrystal growth method has a significant influence on the initial electrical propertiesand stability characteristics. Polycrystalline In_2O_3:Me (Me: W, Ce) filmsdeposited at 200 °C exhibit a relatively high mobility of 70–80 cm~2 V~(-1) s~(-1), arestable after a damp heat test, and improve the mobility of 110–140 cm~2 V~(-1) s~(-1)after postannealing at temperatures greater than the deposition temperature.Conversely, solid-phase crystallized In_2O_3:Me,H films prepared by postannealingamorphous films exhibit an extremely high mobility of 100–160 cm~2 V~(-1) s~(-1);however, they exhibit reduced stability characteristics after the damp heat testand high-temperature annealing process compared to the polycrystalline films.The deterioration of the electrical properties increases as the hydrogen contentin the films increases. The results suggest that polycrystalline and solid-phasecrystallized films should be used properly, according to the device manufacturingprocesses.
机译:透明导电氧化物(TCO)的高电子迁移率促进了高在适度的载波密度下电导率,导致延伸程度由于不太自由载体吸收,从近红外线可见的透明度。这些宽带TCO电极提供了提高性能的机会光电器件。在此,热和潮湿的热稳定性描述了TCO膜的特性。发现差异晶体生长方法对初始电气性质具有显着影响和稳定性特征。多晶In_2O_3:我(我:W,CE)电影沉积在200°C时表现出70-80cm〜2 V〜(-1)S〜(-1)的相对高的迁移率潮湿的热试验后稳定,提高110-140cm〜2 V〜(-1)S〜(-1)的迁移率在高于沉积温度的温度下造成后。相反,固相结晶IN_2O_3:ME,通过底层制备的H薄膜非晶膜具有100-160cm〜2 V〜(-1)S〜(-1)的极高迁移率;然而,它们在潮湿的热试验后表现出降低的稳定性特性与多晶膜相比,高温退火过程。电性能的劣化随着氢含量增加在电影中增加。结果表明多晶和固相根据器件制造,应适当使用结晶薄膜流程。

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