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首页> 外文期刊>Physica status solidi >Enhancing Interfacial Properties of Mg_2Si-Based Thermoelectric Joint with Mg_2SiNi_3 Compound as Electrodes
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Enhancing Interfacial Properties of Mg_2Si-Based Thermoelectric Joint with Mg_2SiNi_3 Compound as Electrodes

机译:用Mg_2sini_3化合物加强Mg_2SI基热电接头的界面性能作为电极

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摘要

The phase component and its evolution during aging at the joint between thermoelectric (TE) materials and electrodes are of much importance to the quality and the performance of the TE devices. While the figure of merit zT of TE materials determines the maximum efficiency of TE devices, undesired side reactions causing the growing interfacial resistance or mechanical failures between TEs and metal electrodes limit the actual performance of devices. Herein, the candidate electrode materials (Mg_2Ni and Mg_2SiNi_3) for Mg_2Si are explored, which is one of the cost-effective and environmentally friendly TE materials exhibiting high zT. The electrodes are directly bonded to Mg_2Si by field-activated pressure-Assisted sintering (FAPAS) in one-step process. The interfaces of fabricated joints with different sintering times are monitored by electron microscopy, followed by the measurement of shear strength and the contact resistances. Outperforming strength (28.29 MPa) and contact resistance (63 μΩ cm~2) are observed with Mg_2SiNi_3 at the joint bonded for 30 min. A long-term stability test on Mg_2SiNi_3/Mg_2Si joint reveals a minute increase in the contact resistance as well as sufficient mechanical stability, suggesting that Mg_2SiNi_3 is a great candidate of the electrode materials for Mg_2Si.
机译:在热电(TE)和电极之间的关节时老化期间的相位分量及其演化对TE器件的质量和性能非常重要。虽然TE材料的优点ZT的数字决定了TE器件的最大效率,但是导致TES和金属电极之间产生不断增长的界面电阻或机械故障限制了器件的实际性能。这里,探索MG_2SI的候选电极材料(MG_2NI和MG_2SINI_3),其是表现出高ZT的成本效益和环保的TE材料之一。在一步法中,通过现场激活的压力辅助烧结(FAPA)直接键合到Mg_2SI。通过电子显微镜监测具有不同烧结时间的制造接头的界面,然后测量剪切强度和接触电阻。在接合30分钟的接头处用Mg_2sini_3观察到优异的强度(28.29MPa)和接触电阻(63μΩcm〜2)。 MG_2SINI_3 / MG_2SI接头上的长期稳定性测试显示了接触电阻的微小增加以及充分的机械稳定性,表明MG_2SINI_3是MG_2SI的电极材料的伟大候选者。

著录项

  • 来源
    《Physica status solidi》 |2020年第15期|1901035.1-1901035.9|共9页
  • 作者单位

    College of Material Science and Engineering Taiyuan University of Technology Taiyuan 030024 China;

    College of Material Science and Engineering Taiyuan University of Technology Taiyuan 030024 China;

    Institute of Physical Chemistry & Center for Materials Research Justus-Liebig-University Giessen Heinrich-Buff-Ring 17 Giessen 35392 Germany;

    College of Material Science and Engineering Taiyuan University of Technology Taiyuan 030024 China;

    College of Physics and Optoelectronics Taiyuan University of Technology Taiyuan 030024 China;

    College of Physics and Optoelectronics Taiyuan University of Technology Taiyuan 030024 China;

    Department of Physics The University of the West Indies Mona Kingston 7 Jamaica;

    College of Material Science and Engineering Taiyuan University of Technology Taiyuan 030024 China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    contact resistances; diffusion bondings; Mg_2Si; Mg_2SiNi_3; thermoelectric joints;

    机译:接触电阻;扩散键合;mg_2si;mg_2sini_3;热电接头;

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