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Influence of ZnO Cap Layer Morphology on the Electrical Properties and Thermal Stability of Al-Doped ZnO Films

机译:ZnO帽层形态对Al掺杂ZnO膜的电性能和热稳定性的影响

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Herein, ZnO cap layers are prepared by chemical vapor deposition on Al-doped ZnO (AZO) films and demonstrate a reduction in the electrical resistivity of the films. When prepared at 600 °C, a continuous ZnO cap layer is formed and leads to an increase in a Hall mobility from 22 to 37 cm2 V~(-1)s~(-1), resulting in a resistivity of 5.1×10~(-4) Ω cm, which is superior to those of nanoparticle and nanorod morphologies formed at lower and higher substrate temperatures, respectively. Furthermore, the continuous ZnO cap layers successfully prevent decreases in the carrier concentration and Hall mobility during annealing at the temperatures of up to 600 °C in air, resulting in a figure of merit (FOM) of 1.6 × 10~(-2) Ω~(-1), which is approximately one order of magnitude better than those of uncapped films annealed in Ar. The improvement is due to the cap layer having proper morphology to provide sufficient protection for restructuring of the AZO grain boundaries, thereby reducing the defect density and sacrificing its structural order to suppress Zn desorption in AZO and environmental oxygen migration into AZO during annealing. Using ZnO as a cap layer also reduces the possibility of introducing unexpected band offset at the interface due to extrinsic elements.
机译:在此,通过在Al掺杂的ZnO(偶氮)膜上的化学气相沉积来制备ZnO帽层,并证明膜的电阻率降低。当在600℃下制备时,形成连续的ZnO盖层,并导致霍尔迁移率的增加,从22到37cm 2 V〜(-1)S〜(-1),导致5.1×10的电阻率〜 (-4)Ωcm,其优于纳米粒子和纳米棒形形貌,分别在较低且较高的基板温度下形成。此外,连续ZnO帽层成功地防止在空气中的温度最高600℃的温度下的载体浓度和霍尔迁移中减少,导致1.6×10〜(-2)Ω的优点(FOM)的数字〜(-1),这比在AR中退火的未结合的薄膜更好地大约一个数量级。改善是由于具有适当形态的帽层,以提供足够的保护来改变偶氮晶界的重组,从而降低缺陷密度并牺牲其结构顺序,以抑制在退火期间Zn中的Zn解吸和环境氧气迁移到偶氮中的Zn解吸。使用ZnO作为盖层也降低了由于外在元素引起的界面中引入意外带偏移的可能性。

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