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首页> 外文期刊>Physica status solidi >V-defect analysis in green and deep green light emitting diode structures
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V-defect analysis in green and deep green light emitting diode structures

机译:绿色和深绿色发光二极管结构中的V缺陷分析

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摘要

In 535-565 nm green and deep green LED dies on c-planc sapphire, we correlate the structural morphology with photo-luminescence performance. Two classes of material with active region roughness of 4 nm and 0.4 nm (RMS) are analyzed in transmission electron microscopy. In the rough material, a high density of edge-type dislocations is identified that originates within the quantum wells (QWs). They initiaternV-defects that exhibit {1011} growth facets with a second set of narrow QWs and barriers. As V-defects "widen with progressive growth, the width of QW and barriers on the c-plane increases. In the smooth material, however, no V-defects can be found. QWs and barriers are highly uniform and homogenous throughout the structure.
机译:在c平面蓝宝石上的535-565 nm绿色和深绿色LED芯片中,我们将结构形态与光致发光性能相关联。在透射电子显微镜中分析了两类有源区粗糙度分别为4 nm和0.4 nm(RMS)的材料。在粗糙的材料中,识别出高密度的边缘型位错,其起源于量子阱(QW)内。他们用第二组狭窄的QW和壁垒来引发具有{1011}生长面的rnV缺陷。随着V缺陷“随着逐渐增长而扩大,QW的宽度和c面上的势垒增加。但是,在光滑的材料中,找不到V缺陷。QW和势垒在整个结构中是高度均匀且均匀的。

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  • 来源
    《Physica status solidi 》 |2008年第6期| 1777-1779| 共3页
  • 作者单位

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

    Future Chips Constellation, Rensselaer Polytechnic Institute, Troy, NY 12180, USA and Department of Physics, Applied Physics, and Astronomy, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;

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  • 正文语种 eng
  • 中图分类
  • 关键词

    direct observation of dislocations and other defects (etch pits, decoration, electron microscopy, X-ray topography, etc.); transmission electron microscopy (TEM) (including STEM, HRTEM, etc.); quantum wells; Ⅲ-Ⅴ semiconductors; light-emitting devices;

    机译:直接观察位错和其他缺陷(蚀刻坑;装饰;电子显微镜;X射线形貌等);透射电子显微镜(TEM)(包括STEM;HRTEM等);量子阱Ⅲ-Ⅴ族半导体;发光装置;

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