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Excess Carrier Density Variations in Test Structures for Photoconductance-Based Contact Recombination Current Measurements

机译:用于基于光电导的接触复合电流测量的测试结构中的过多载流子密度变化

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摘要

We recently proposed a novel test structure for the extraction of recombination characteristics of metal-contacted areas on silicon wafers using quasi-steady state photoconductance measurements. In this test structure, photoconductance measurements are performed on several wafer areas with different contact fractions. Each area consists of a lattice of point contacts on an otherwise passivated wafer. The requirement of constant excess carrier densities throughout the quasi-neutral wafer bulk is absolutely essential for the simple extraction of figures of merit for contact recombination. In this study, we first discuss the requirements for constant injection levels during photoconductance measurements, without reference to a particular geometry. Then, we use a simple 1-D model to elucidate how injection levels vary in the test structure plane. We use the model to investigate limiting cases for which the requirement of constant injection levels is satisfied. In addition, we investigate the breakdown of the assumption of constant injection levels. We discuss the influence of nonconstant excess carrier concentrations on photoconductance measurements in the context of our test structure. Finally, we validate our model by comparison with experiments. Our analysis is particularly useful in the context of understanding the design rules for contact size and pitch in our test structure.
机译:我们最近提出了一种新的测试结构,用于使用准稳态光电导测量来提取硅晶片上金属接触区域的复合特征。在此测试结构中,对具有不同接触分数的几个晶圆区域执行光电导测量。每个区域都由其他钝化晶片上的点接触点组成。对于简单提取接触复合的品质因数,在整个准中性晶圆块中保持恒定的过剩载流子密度是绝对必要的。在这项研究中,我们首先讨论在光导测量过程中恒定注入水平的要求,而不涉及特定的几何形状。然后,我们使用一个简单的一维模型来阐明注入水平在测试结构平面中如何变化。我们使用该模型来研究满足恒定注射水平要求的极限情况。此外,我们研究了恒定注入量假设的分解。在我们的测试结构中,我们讨论了非恒定过量载流子浓度对光电导测量的影响。最后,我们通过与实验进行比较来验证我们的模型。在理解测试结构中触点尺寸和间距的设计规则时,我们的分析特别有用。

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