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Advanced nanomechanics in the TEM: effects of thermal annealing on FIB prepared Cu samples

机译:TEM中的先进纳米力学:热退火对FIB制备的Cu样品的影响

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The effect of focused ion beam (FIB) fabrication on the mechanical properties of miniaturized mechanical tests has recently been realized, but is not well documented. In this study, the effect of post thermal annealing on the plastic properties of FIB fabricated micro- and nanometer-sized Cu samples was studied by means of advanced analytic and in situ transmission electron microscopy. In situ heating experiments on thin films and pillars revealed a reduction of the initially high dislocation density, but never a recovery of the bulk dislocation density. Aberration-corrected atomic imaging documented the recovery of a pristine crystalline surface structure upon annealing, while electron energy-loss spectroscopy showed that the remaining contamination layer consisted of amorphous carbon. These structural observations were combined with the mechanical data from in situ tests of annealed micro- and nanometer-sized tensile and compression samples. The thermal annealing in the micron regime mainly influences the initial yield point, as it reduces the number of suited dislocation sources, while the flow behavior is mostly unaffected. For the submicron samples, the annealed material sustains significantly higher stresses throughout the deformation. This is explained by the high stresses required for surface-mediated dislocation nucleation of the annealed material at the nanoscale. In the present case, the FIB affected the surface near defects and facilitated dislocation nucleation, thereby lowering the material strength.View full textDownload full textKeywordsnanomechanics, size effect, focused ion beam (FIB), thermal annealing, atomic imaging, electron energy-loss spectroscopy (EELS), in situ testing, dislocationRelated var addthis_config = { ui_cobrand: "Taylor & Francis Online", services_compact: "citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,more", pubid: "ra-4dff56cd6bb1830b" }; Add to shortlist Link Permalink http://dx.doi.org/10.1080/14786435.2012.685966
机译:最近已经实现了聚焦离子束(FIB)制造对小型机械测试的机械性能的影响,但尚未充分证明。在这项研究中,通过先进的分析和原位透射电子显微镜研究了后热退火对FIB制备的微米和纳米尺寸Cu样品塑性性能的影响。在薄膜和柱上进行的原位加热实验表明,最初的高位错密度降低了,但总体位错密度却没有恢复。像差校正原子成像记录了退火后原始晶体表面结构的恢复,而电子能量损失谱表明剩余的污染层由非晶碳组成。将这些结构观察结果与退火的微米和纳米尺寸拉伸和压缩样品的原位测试的机械数据相结合。微米状态下的热退火主要影响初始屈服点,因为它减少了合适的位错源的数量,而流动行为却几乎不受影响。对于亚微米样品,退火后的材料在整个变形过程中承受明显更高的应力。这可以通过退火材料在纳米尺度上进行表面介导的位错成核所需的高应力来解释。在当前情况下,FIB影响了缺陷附近的表面并促进了位错成核,从而降低了材料强度。查看全文下载全文关键词纳米力学,尺寸效应,聚焦离子束(FIB),热退火,原子成像,电子能量损失谱(EELS),原位测试,脱位相关变量var addthis_config = {ui_cobrand:“泰勒和弗朗西斯在线”,servicescompact:“ citlikelike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,更多”,pubid: “ ra-4dff56cd6bb1830b”};添加到候选列表链接永久链接http://dx.doi.org/10.1080/14786435.2012.685966

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