Moisture and Creep Effects on Paper, Board and Containers

摘要

The journal Packaging Technology and Science will publish a special issue on 'Moisture and Creep Effects on Paper, Board and Containers'. The Editors for this issue will be David Shires and Diana Twede (the Editors-in-Chief of Packaging Technology & Science). Authors are invited to contact the Editors to discuss their potential contribution prior to submission.rnSuitable topics include:rn1. moisture and heat transferrn2. container design and performancern3. material characterization and selectionrn4. durability and degradationrn5. new materials and productsrn6. nano-material applications.