BN thin film as thermal interface mateiral for high power LED: thermal resistance and optical analysis

摘要

Over heat in junction temperature of an LED can impact the luminous performance of the lighting system. The more heat extracted from the system, the easier the LEDs can be driven; resulting in more light output and possibly a reduction in the number of LEDs needed to achieve the desired level of light output. Consequently, thin film based thermal interface mateiral (TIM) has been suggested and BN thin film was prepared on Cu substrate which is used as TIM. The 3W green LED was tested with BN thin film interface and observed low T_J and total thermal resistance (R_(th-tot)) value at 700mA. The ΔT_J was 3.79℃ which was high compared to bare Cu. Overall, BN thin films was performed well on maintaining both the T_J and the optical output considerably and could be an alternative for commersial thermal paste.