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Effects of moisture conditions of dental enamel surface on bond strength of brackets bonded with moisture-insensitive primer adhesive system

机译:牙釉质表面水分条件对不敏感水分的底漆胶体系粘结支架强度的影响

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摘要

The purposes of this study were to evaluate the effects of different degrees of water contamination on the shear bond strength of orthodontic brackets bonded to dental enamel with a moisture-insensitive primer (MIP) adhesive system and to compare the modes of bracket/adhesive failure. A total of 68 human premolars were divided into four groups by primers and enamel surface conditions (desiccated, blot dry, and overwet). In group I, the hydrophobic Transbond XT primer adhesive system was used under desiccated conditions for bonding the brackets; in group II, the hydrophilic Transbond MIP adhesive system was used under desiccated conditions; in group III, the hydrophilic Transbond MIP adhesive system was used under blot dry conditions; and in group IV, the hydrophilic Transbond MIP adhesive system was used under overwet conditions. Shear bond strength was measured with a universal testing machine, and the mode of bracket/adhesive failure was determined according to the adhesive remnant index. The mean shear bond strengths were not significantly different among groups I, II, and III, and were higher than the clinically required range of 6 to 8 MPa. The mean shear bond strength achieved in group IV was significantly lower than that achieved in groups I, II, and III, and also lower than the clinically required values. Bond failure occurred at the enamel-adhesive interface more frequently in group IV than in groups I and III. To achieve clinically sufficient bond strengths with the hydrophilic MIP adhesive system, excess water should be blotted from the water-contaminated enamel surface.
机译:这项研究的目的是评估不同程度的水污染对使用不敏感水分的底漆(MIP)粘合剂体系粘结到牙釉质的正畸托槽的剪切粘结强度的影响,并比较托槽/粘附失败的方式。通过底漆和搪瓷表面条件(干燥,吸干和过湿)将总共68个人类前磨牙分为四组。在第一组中,在干燥条件下使用疏水性的Transbond XT底漆粘合剂体系粘合托架。在第二组中,在干燥条件下使用亲水性Transbond MIP粘合剂体系。在第三组中,在印迹干燥条件下使用亲水性Transbond MIP粘合剂体系。 IV组中,在过湿条件下使用亲水性Transbond MIP粘合剂体系。用万能试验机测量剪切粘合强度,并根据粘合残余指数确定托槽/粘合破坏的方式。 I,II和III组之间的​​平均抗剪强度没有显着差异,并且高于临床要求的6至8 MPa范围。 IV组获得的平均剪切粘结强度显着低于I,II和III组,也低于临床所需值。与第一和第三组相比,第四组在牙釉质-胶粘剂界面发生粘结破坏的频率更高。为了在临床上与亲水性MIP粘合剂体系达到足够的粘合强度,应从受水污染的搪瓷表面上吸去多余的水。

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  • 来源
    《Odontology》 |2008年第1期|50-54|共5页
  • 作者单位

    Orthodontic Dentistry The Nippon Dental University Niigata Hospital 1-8 Hamaura-cho Chuo-ku Niigata 951-8580 Japan;

    Orthodontic Dentistry The Nippon Dental University Niigata Hospital 1-8 Hamaura-cho Chuo-ku Niigata 951-8580 Japan;

    Pediatric Dentistry The Nippon Dental University Niigata Hospital Niigata Japan;

    Department of Operative Dentistry The Nippon Dental University School of Life Dentistry at Niigata Niigata Japan;

    Department of Operative Dentistry The Nippon Dental University School of Life Dentistry at Niigata Niigata Japan;

    Department of Pediatric Dentistry The Nippon Pental University School of Life Dentistry at Niigata Niigata Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Moisture condition; Moisture-insensitive primer; Shear bond strength; Adhesive remnant index;

    机译:湿度条件;对水分不敏感的底漆;剪切粘结强度;粘合残留指数;

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