In situ beam angle measurement in a multi-wafer high current ion implanter

摘要

Direct, in situ measurement of the average angle and angular content of an ion beam in a multi-wafer ion implanter is reported for the first time. A new type of structure and method are described. The structures are located on the spinning disk, allowing precise angular alignment to the wafers. Current that passes through the structures is known to be within a range of angles and is detected behind the disk. By varying the angle of the disk around two axes, beam current versus angle is mapped and the average angle and angular spread are calculated.The average angle measured in this way is found to be consistent with that obtained by other techniques, including beam centroid offset and wafer channeling methods. Average angle of low energy beams, for which it is difficult to use other direct methods, is explored. A "pencil beam" system is shown to give average angle repeatability of 0.13 degrees (1 sigma) or less, for two low energy beams under normal tuning variations, even though no effort was made to control the angle. (c) 2005 Elsevier B.V. All rights reserved.