Chemical Mechanical Polishing Monitor for LSI Fabrication

摘要

A unique CMP monitor was developed that can detect and analyze the vibration of a silicon wafer during polishing, which improves both processing precision and productivity, where are large problems in LSI manufacturing. Using this CMP monitor can detect all kinds of abnormal polishing. The sensitivity of this CMP monitor is very high, for detection, analysis and storage of all phenomena that occur during the CMP process. Installing this monitor into the CMP equipment is simple and requires only a small modification to the polishing equipment. Therefore, the technical contribution that this CMP monitor provides is being actively promoted to manufacturers of polishing equipment. In doing so it will be possible to purchase and use CMP equipment that is installed with this monitor from the start. With the introduction of this CMP monitor, there will be a further improvement in CMP technology.