Quantitative Analysis of Failure Mode in Adhesively Bonded Test Specimens

摘要

After adhesively bonded mechanical test specimens have been tested to failure, the failure mode must be interpreted and quantified. Areas of the adherent that are bare (no residual adhesive remains) have undergone adhesive failure. The remainder of the surface has undergone cohesive failure. The ability to distinguish and accurately quantify the relative amounts of cohesive and adhesive failure on a failed bonding surface is of tremendous importance in the field of mechanical testing, and for the development of bonded assemblies. Some adhesives (and adherents) are fluorescent, meaning they re-emit light at a different wavelength after being irradiated by some lighting source. This property allows for quantitative analysis of the adhesive failure mode (adhesive and cohesive). A digital image of the fluorescing adhesive or adherent can be analyzed and quantified using publicly available software to determine the relative areas of exposed and covered adherent surface.