Aluminum Diamond Heat Spreader Material for GaN Devices

摘要

Nano Materials International has introduced aluminum diamond metal matrix composites (MMC) for use as heat spreaders that can reduce GaN junction temperatures by up to 25 percent, has a coefficient of thermal expansion (CTE) close to that of SiC and metallization well suited for die attach. They also have excellent dimensional tolerances and material stability. In addition, they can be economically produced in large quantities while adding a minimal cost to each GaN device.