Semiconductor Technology Drives the EDI CON 2014 Technical Program

摘要

The dust has settled on the final rush for turning in materials before the submission deadline for the peer-reviewed technical program at EDI CON 2014, to be held this April in Beijing, China. With an emphasis on high frequency and highspeed electronic design, this year's crop of papers reflects many industry trends that define the state-of-the-art in RF, microwave and high-speed digital design, measurement, simulation and components. The focus of this industry-driven event is to educate attendees on the latest techniques, tools and devices available to help engineers achieve their goals, whether that is to optimize their amplifier's linearity and efficiency, improve the dynamic range of their receiver chain or address any number of electronic design challenges. In addition, the conference will examine evolving technology in the context of those communication systems driving development and investment.