Thermal Power Handling and Testing of RF PCBs for Deep Space Communication

摘要

Thermal analysis, simulation and benchtop testing of an X-Band transmitter RF power amplifier (RFPA) printed circuit board (PCB) for the University of Colorado, Boulder Earth Escape Explorer Deep Space CubeSat shows that FujiPoly XR-Um thermal interface material (TIM) provides a better solution compared to the alternatives considered. Results show a reduction in the operational temperature of the PCB from greater than 120°C to 77°C, which is below the maximum 85°C environmental operating temperature of the RFPA.