Characterization and modeling of bond wires for high-frequency applications

摘要

Bond wires are used as the standard method of connecting microwave ICs and interconnect circuitry. The high impedance of the bond wires causes inductive discontinuities, which result in impedance mismatches and unwanted reflections. Various techniques have been used to provide lower mismatch interconnects between circuits, such as minimizing the gap between the circuits to shorten the bond wires, using wider ribbon bonds for lower impedance to connect the circuits, and even going to flip chip ICs to achieve lower inductance interconnects.