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A Compact 140-GHz, 150-mW High-Gain Power Amplifier MMIC in 250-nm InP HBT

机译:250nm InP HBT中的紧凑型140GHz,150mW高增益功率放大器MMIC

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We report here a compact 140-GHz, 150-mW highgain solid-state power amplifier (SSPA) monolithic microwave integrated circuit (MMIC) demonstrated in a 250-nm InP HBT technology. It utilizes five-gain stages and two-way on-chip power combining. The amplifier measures 29.5-dB mid-band S21 gain and over 125-mW output power across 115-150-GHz operation. The peak 153-mW output power was measured at 140 GHz using only 2.7-mW RF input power-the associated large-signal gain is 17.5 dB with 9.8% power added efficiency (PAE). The 140-GHz OP1 dB 1-dB gain compression power is 106 mW with 7.0% PAE. The dc power dissipation is 1.54 W and its size is only 0.75 mm2. The 3-dB S21 gain roll-off is between 112 and 147 GHz. The 115-150-GHz output power variation at 0-dBm input drive is only +/- 0.5 dB. The peak PAE varies between 8.2% and 10.5%. This D-band result improves upon by 2.3x at 140 GHz the state-of-theart peak RF power previously demonstrated by SSPA MMICs.
机译:我们在这里报告了一种紧凑型140 GHz,150 mW高增益固态功率放大器(SSPA)单片微波集成电路(MMIC),该器件在250 nm InP HBT技术中得到了展示。它利用五增益级和两路片上功率组合。该放大器在115-150 GHz工作频率范围内可测量29.5 dB中频带S21增益和超过125 mW的输出功率。仅在使用2.7mW射频输入功率的情况下,在140 GHz处测得的峰值153mW输出功率-相关的大信号增益为17.5 dB,功率附加效率(PAE)为9.8%。 140 GHz OP1 dB 1-dB增益压缩功率为106 mW,PAE为7.0%。直流功耗为1.54 W,其尺寸仅为0.75 mm2。 3dB S21增益衰减在112至147 GHz之间。输入驱动为0 dBm时115-150 GHz的输出功率变化仅为+/- 0.5 dB。峰值PAE在8.2%和10.5%之间变化。在140 GHz时,此D波段结果将SSPA MMIC展示的最新RF峰值功率提高了2.3倍。

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