Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-off

摘要

A submicron-scale surface acoustic wave (SAW) resonator fabricated by high-aspect-ratio X-ray lithography (XRL) and metal lift-off that operates at microwave frequencies is presented. We demonstrate that XRL is especially well suited for SAW device templating, as long submicron-scale interdigitated transducer structures can be batch patterned with excellent structure quality. 0.4–2.0 μm thick PMMA layers were structured by X-ray lithography shadow projection using silicon nitride-based X-ray masks. Structures with a critical lateral feature size of down to 200–700 nm were processed. The polymer structures served as templates in a subsequent aluminum lift-off process. The metal electrodes were successfully tested as SAW resonators for high frequency applications, e.g. around 1.3 GHz, using calibrated 1-port RF wafer probing measurements. Compared with standard fabrication techniques, the high structure quality of submicron-scale polymer templates made of unusually thick PMMA layers offers additional possibilities to fabricate thicker metal transducers.