Closed-form expressions for the coupling capacitance of metal fill tiles in VLSI circuits

摘要

A closed-form formula is presented for the computation of the capacitive coupling of dummy metal tiles and their impact on other structures. It is obtained by an equivalent problem for which an analytical solution already exists. The proposed approach is faster than the electromagnetic methods whereas it can succeed the same level of accuracy. Comparative simulation results as obtained by two commercial tools show a close agreement with the proposed formulation suggesting its validity.