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RF-MEMS load sensors with enhanced Q-factor and sensitivity in a suspended architecture

机译:悬挂架构中具有增强的Q因子和灵敏度的RF-MEMS负载传感器

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摘要

In this paper, we present and demonstrate RF-MEMS load sensors designed and fabricated in a suspended architecture that increases their quality-factor (Q-factor), accompanied with an increased resonance frequency shift under load. The suspended architecture is obtained by removing silicon under the sensor. We compare two sensors that consist of 195 μm x 195 μm resonators, where all of the resonator features are of equal dimensions, but one's substrate is partially removed (suspended architecture) and the other's is not (planar architecture). The single suspended device has a resonance of 15.18 GHz with 102.06 Q-factor whereas the single planar device has the resonance at 15.01 GHz and an associated Q-factor of 93.81. For the single planar device, we measured a resonance frequency shift of 430 MHz with 3920 N of applied load, while we achieved a 780 MHz frequency shift in the single suspended device. In the planar triplet configuration (with three devices placed side by side on the same chip, with the two outmost ones serving as the receiver and the transmitter), we observed a 220 MHz frequency shift with 3920 N of applied load while we obtained a 340 MHz frequency shift in the suspended triplet device with 3920 N load applied. Thus, the single planar device exhibited a sensitivity level of 0.1097 MHz/N while the single suspended device led to an improved sensitivity of 0.1990 MHz/N. Similarly, with the planar triplet device having a sensitivity of 0.0561 MHz/N, the suspended triplet device yielded an enhanced sensitivity of 0.0867 MHz/N.
机译:在本文中,我们介绍并演示了采用悬挂式架构设计和制造的RF-MEMS负载传感器,该传感器提高了其品质因数(Q-factor),并增加了负载下的谐振频率偏移。通过去除传感器下方的硅获得悬挂式架构。我们比较了两个由195μmx 195μm谐振器组成的传感器,其中所有谐振器特征均具有相同的尺寸,但一个传感器的基板被部分移除(悬浮结构),而另一个则不被移除(平面结构)。单个悬挂设备的谐振频率为15.18 GHz,Q因子为102.06,而单个平面设备的谐振频率为15.01 GHz,相关的Q因子为93.81。对于单个平面设备,我们在施加3920 N负载的情况下测得430 MHz的谐振频率偏移,而在单个悬挂设备中实现了780 MHz的频率偏移。在平面三重态配置中(三个设备并排放置在同一芯片上,两个最外面的设备分别用作接收器和发送器),我们观察到220 MHz的频移和3920 N的施加负载,而我们得到了340施加3920 N负载的悬挂三重态器件中的MHz频移。因此,单个平面设备的灵敏度水平为0.1097 MHz / N,而单个悬挂设备的灵敏度水平为0.1990 MHz / N。类似地,对于灵敏度为0.0561 MHz / N的平面三重态器件,悬挂的三重态器件产生了0.0867 MHz / N的增强灵敏度。

著录项

  • 来源
    《Microelectronic Engineering》 |2011年第3期|p.247-253|共7页
  • 作者单位

    Departments of Electrical Engineering and Physics, Nanotechnology Research Center, and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara 06800, Turkey;

    Departments of Electrical Engineering and Physics, Nanotechnology Research Center, and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara 06800, Turkey;

    Departments of Electrical Engineering and Physics, Nanotechnology Research Center, and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara 06800, Turkey;

    Department of Mechanical Engineering, Orthopaedic Bioengineering Research Laboratory, Colorado State University, Fort Collins, CO 80523, USA;

    Departments of Electrical Engineering and Physics, Nanotechnology Research Center, and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara 06800, Turkey;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    fabrication; ic; resonance frequency shift; quality-factor; bio-implant; rf-mems;

    机译:制造;ic;共振频移;品质因数;生物植入物;rf-mems;

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