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Frequency dependent dielectric properties and electrical conductivity of platinum silicide/Si contact structures with diffusion barrier

机译:具有扩散势垒的硅化铂/硅接触结构的频率相关介电特性和电导率

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摘要

Unlike a conventional metal-Si compounds/Si structure, a thin film TiW alloy was deposited on PtSi/n-Si to form a diffusion barrier between aluminum (Al) and PtSi/n-Si. Dielectric properties and electrical conductivity of contact structures have been investigated in detail by using experimental C-Vand G-V measurements in the frequency range of 3 kHz-5 MHz and voltage range of -2-4 V. Experimental results indicate that the values of ε' show a steep decrease with increasing frequency for each voltage. On the other hand, the values of ε" versus voltage curves show a jump, and ε" decreases with decreasing voltage and increasing frequency.The weak increasing of the ac electrical conductivity (σ_(ac)) on frequency is observed. The real part of electric modulus (M') increases with increasing frequency. Also, the imaginary part of electric modulus (M") shows a peak and the peak position shifts to higher frequency with increasing applied voltage. The energy loss tan δ versus frequency has a weak wide peak at 300 kHz for each voltage. It can be concluded that the interfacial polarization can be more easily occurred at low frequencies, and the majority of interface states at metal semiconductor interface, contributes to deviation of dielectric properties of Al-TiW-PtSi/n-Si structures.
机译:与常规的金属-Si化合物/ Si结构不同,薄膜TiW合金沉积在PtSi / n-Si上以在铝(Al)和PtSi / n-Si之间形成扩散势垒。通过在3 kHz-5 MHz频率范围和-2-4 V电压范围内进行实验C-V和GV测量,详细研究了接触结构的介电性能和电导率。实验结果表明ε'值随每个电压的频率增加而急剧下降。另一方面,ε“相对于电压的曲线显示出一个跳跃,并且ε”随着电压的降低和频率的增加而减小。观察到交流电导率(σ_(ac))在频率上的微弱增加。电模量的实数部分(M')随着频率的增加而增加。此外,电模量的虚部(M“)出现一个峰值,并且峰值随着施加电压的增加而移向更高的频率。能量损耗tanδ与频率的关系在每个电压下300 kHz处都有一个较弱的宽峰值。得出的结论是,界面极化在低频下更容易发生,并且金属半导体界面处的大多数界面态都导致Al-TiW-PtSi / n-Si结构介电性能的偏离。

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