The availability of a single system to coordinate all machine control tasks will improve tool performance, throughput, and reliability. The transition from 200- to 300-mm wafers will bring a 30-40% reduction in die costs, but the high cost of building the new fabs and the greater unit value per wafer combine to make yields, defect incidence, tool throughput, and downtime critical factors in achieving an acceptable return on investment. To achieve their financial goals, chip manufacturers must demand the highest levels of sophistication in the tools used throughout the manufacturing process, including during wafer handling, transport, and storage.
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