Reducing defects methodically through fab/vendor process and metrology collaboration

摘要

Three defect-reduction and productivity-enhancement projects carried out at Philips Semiconductors showed the value of adopting a methodical approach to process equipment-related particle contamination problems. Such a methodology results in permanent solutions, not just problem masking. SEM-based defect review and characterization was found to play a central role in this approach, making it possible to quickly identify main defect types and trends. The synergy of process (equipment) and defect metrology knowledge developed by the equipment manufacturer was shown to be advantageous in solving equipment issues together with the chip manufacturer.