METROLOGY: Pressures Build on Tool Performance

摘要

"Shrinking feature sizes, tighter control of device electrical parameters, such as threshold voltage and leakage current, and new interconnect materials will provide the main challenges for physical metrology methods." So says the metrology chapter in the latest International Technology Roadmap for Semiconductors (ITRS). The demands on metrology and inspection equipment will become increasingly stringent with each successive process node. For this installment of The Hot Button, we asked experts what they thought the critical issues were in the metrology area, and why.