EBSD investigation of the effect of the solidification rate on the nucleation behavior of eutectic components in a hypoeutectic Al-Si-Cu alloy

摘要

This article represents a study of the influence of the solidification rate on the crystallographic orientation of eutectic components with respect to the primary α-Al in the tested hypoeutectic alloy. Electron backscattering diffraction (EBSD) patterns were produced from the Al-Si cast specimens that were solidified with different cooling rates and prepared via ion etch polishing as a complementary method after mechanical polishing. The results indicated a strong orientation relationship between the primary α-Al and eutectic Al phase at all cooling rates. It was also found that the silicon eutectic flakes were heterogeneously nucleated in the interdendritic eutectic liquid. The increase of the cooling rate from 2 to 80 mm/min was found to be effective in lowering the intensity of the relationship between the primary α-Al and eutectic Al phases, and changing the misorientation angle clustering between the primary α-Al and eutectic Si phases in the interval from 41–60° to lower angle intervals.