Commercially pure copper was joined to a 1050 aluminum alloy by friction stir welding. A specific configuration where the tool pin was fully located in the aluminum plate was chosen. In such a situation, there is no mechanical mixing between the two materials, but frictional heating gives rise to a significant thermally activated interdiffusion at the copper/aluminum interface. This gives rise to the formation of defect-free joints where the bonding is achieved by a very thin intermetallic layer at the Cu/Al interface. Nanoscaled grains within this bonding layer were characterized using transmission electron microscopy (TEM). Two phases were identified, namely, Al2Cu and Al4Cu9 phases. The nucleation and growth of these two phases are discussed and compared to the standard reactive interdiffusion reactions between Cu and Al.
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机译：通过摩擦搅拌焊接将商业上纯的铜连接到1050铝合金上。选择了一种特定的配置，其中工具销完全位于铝板上。在这种情况下，两种材料之间没有机械混合，但是摩擦加热在铜/铝界面处引起了明显的热活化互扩散。这导致形成无缺陷的接头，其中通过在Cu / Al界面处的非常薄的金属间层实现粘结。使用透射电子显微镜（TEM）表征了该粘结层中的纳米级晶粒。确定了两个相，即Al 2 Cu和Al 4 Cu 9 相。讨论了这两个相的成核和生长，并将其与标准的铜和铝之间的反应性互扩散反应进行了比较。
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