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Spark Plasma Sintering of Nanocrystalline Cu and Cu-10 Wt Pct Pb Alloy

机译:纳米晶Cu和Cu-10 Wt Pct Pb合金的放电等离子烧结

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摘要

For the first time, we report here that high purity nanocrystalline Cu and Cu-10 wt pct Pb alloys can be densified with more than 90 pct theoretical density at a low temperature of 623 K (350 °C) using spark plasma sintering (SPS) in argon atmosphere at a pressure of 100 MPa. Scanning electron microscopy (SEM) analysis indicates that molten Pb particles travel through Cu grain boundaries, delineating a “flowlike” pattern in the microstructure. An extensive transmission electron microscopy (TEM) analysis of the ultrafine scale microstructure reveals partial wetting of Cu by liquid Pb as well as entrapment of Pb particles within the Cu matrix. The sintering kinetics and microstructural evolution are discussed in reference to the intrinsic characteristics of SPS as well as phase equilibria in the Cu-Pb system. An important result is that high hardness of around 2 GPa is measured in the Cu-10 wt pct Pb nanostructured alloy, SPS at 573 K to 623 K (300 °C to 350 °C).
机译:首次,我们在这里报告,可以使用火花等离子体烧结(SPS)在623 K(350°C)的低温下以高于90 pct的理论密度致密化高纯度纳米晶Cu和Cu-10 wt pct的Pb合金。在氩气中,压力为100 MPa。扫描电子显微镜(SEM)分析表明,熔融的Pb颗粒穿过Cu晶界,从而在微观结构中描绘出“流状”图案。对超微尺度微观结构的广泛透射电子显微镜(TEM)分析显示,液态Pb润湿了Cu的部分润湿以及Pb颗粒在Cu基体内的截留。参照SPS的固有特性以及Cu-Pb系统中的相平衡,讨论了烧结动力学和微观结构演变。一个重要的结果是,在573 K至623 K(300°C至350°C)的Cu-10 wt pct Pb纳米结构合金SPS中测得的高硬度约为2 GPa。

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