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STRIPPING METALLIC COATINGS

机译:剥离金属涂层

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摘要

Metallic coatings are stripped when parts are rejected after plating because of one or more of the following defects: 1. lack of deposit uniformity; 2. discoloration; 3. roughness; 4. lack of adhesion; 5. poor coverage; or 6. insufficient thickness. If the parts are valuable, reclamation via stripping and replating is feasible. Precious metals such as rhodium, gold, and silver are so valuable that even small quantities are worth reclaiming. In the printed circuit board industry, metallic resists such as tin or tin-lead are selectively stripped from contact tabs. The stripping should be done with as much care and planning as was required for the original plating process. Acids used in stripper formulations must be sufficiently strong to remove the deposit being stripped, yet should not appreciably attack the base metal. The chemical activity of a specific acid can usually be suppressed by limiting the water content in a system. This is accomplished by either using concentrated acids such as sulfuric, acetic, or phosphoric, which contain little water, or by adding organics such as glycerine to the acids instead of water. Chelating agents, which are specific for the metal being stripped, may be added to a stripping solution to prevent redeposition of the metal being stripped by immersion.
机译:当电镀后由于以下一种或多种缺陷而报废零件时,会剥去金属涂层:1.沉积均匀性不足; 2.变色3.粗糙度; 4.缺乏附着力; 5.覆盖范围差;或6.厚度不足。如果零件有价值,则通过剥离和再电镀进行回收是可行的。诸如铑,金和银之类的贵金属是如此珍贵,以至于即使少量也值得回收。在印刷电路板工业中,有选择地从接触片上剥离金属抗蚀剂,例如锡或锡铅。剥离应与原始电镀过程所需要的一样多的谨慎和计划。汽提塔配方中使用的酸必须足够强以除去被汽提的沉积物,但不应明显侵蚀贱金属。通常可以通过限制体系中的水含量来抑制特定酸的化学活性。这可以通过使用浓缩的酸(例如几乎不含水的硫酸,乙酸或磷酸)来实现,也可以通过向酸中添加有机物(如甘油)代替水来实现。可以将特定于被剥离金属的螯合剂添加到剥离溶液中,以防止因浸渍而使被剥离金属再沉积。

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