Strip Plating with In-Line Solder Reflow

摘要

The plating of strip material in a continuous or in-line fashion has been around for many years. Installations can be found worldwide, in industries ranging from electronics to general metals fabrication. Some of the more common applications include: 1. Electroplating and electroforming of copper foil for thin film and circuit boards 2. Electroplating of connectors in bandoliered, punched products, and solid strip form 3. Electrogalvanizing of steel. Solder plating with integrated in-line reflow has been gaining rapid acceptance over the past several years. In developing the proper equipment for a continuous solder plating operation, several basic issues must be resolved. 1. Which chemistry will be used? 2. What waste treatment capabilities are available or will be required? 3. What is the desired production rate? 4. How much floor space is available for the equipment? 5. What type of controls are required?