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MEASUREMENT OF THE THERMAL PARAMETERS OF SEMICONDUCTOR PRODUCTS USING PULSE-AMPLITUDE MODULATION OF THE HEATING POWER

机译:利用加热功率的脉冲幅度调制来测量半导体产品的热参数

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摘要

Estimates of the systematic error in measuring a temperature-sensitive parameter of a semiconductor article are obtained. These errors are due to transient electrical and thermal processes which occur when the article is switched from the heating mode to the measurement mode. It is shown that the use of pulse-amplitude modulation of the heating power enables these errors to be reduced considerably.
机译:获得了在测量半导体制品的温度敏感参数时的系统误差的估计。这些误差是由于在将物品从加热模式切换到测量模式时发生的瞬时电和热过程所致。结果表明,使用加热功率的脉冲幅度调制使这些误差大大减小。

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