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Study on Reactive Species in Catalyst-Referred Etching of 4H-SiC using Platinum and Hydrofluoric Acid

机译:铂和氢氟酸催化4H-SiC刻蚀的反应物种研究

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摘要

In this study, we developed a novel abrasive-free polishing method called the catalyst-referred etching (CARE). CARE can chemically remove SiC using an etching agent activated by a catalyst. Platinum and hydrofluoric (HF) acid are used for the planarization of SiC substrates as a catalyst and etchant, respectively. CARE can produce an atomically flat surface of 4H-SiC (0001) with a root-mean-square roughness <0.1 nm, regardless of the cut-off angle. However, the mechanism of CARE has not yet been clarified. In this study, to clarify the mechanism, KF and NH4F are added to the etchant. An investigation revealed that the removal rate is proportional to [HF] ×([F~] + [HF_~2-]), and it is shown that both the HF molecule and fluorine ions (F~- and HF_2~-) are reactive species of the CARE process.
机译:在这项研究中,我们开发了一种新颖的无磨料抛光方法,称为催化剂参考蚀刻(CARE)。 CARE可以使用由催化剂激活的蚀刻剂来化学去除SiC。铂和氢氟酸(HF)分别用于SiC衬底的平坦化,作为催化剂和蚀刻剂。 CARE可以产生4H-SiC(0001)的原子平面,其均方根粗糙度<0.1 nm,与截止角无关。但是,CARE的机制尚未阐明。在这项研究中,为阐明机理,将KF和NH4F添加到蚀刻剂中。研究表明,去除率与[HF]×([F〜] + [HF_〜2-])成正比,表明HF分子和氟离子(F〜-和HF_2〜-)均为CARE过程的反应性物质。

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  • 来源
    《Materials science forum》 |2013年第2013期|847-850|共4页
  • 作者单位

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Ebara Corporation, 4-2-1 Hon-fujisawa, Fujisawa, Kanagawa 251-8502, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    SiC; polishing; platinum; fluoric acids; catalyst; potassium fluoride; ammonium fluoride; etching;

    机译:碳化硅;抛光;铂;氟酸催化剂;氟化钾氟化铵;蚀刻;

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