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Experimental and Numerical Simulation of Surface Segregation in Two-phase Zone Continuous Casting Cu-Sn Alloy

机译:两相区连铸Cu-Sn合金表面偏析的实验与数值模拟

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摘要

Surface segregation exists in two-phase zone continuous casting (TZCC) alloy with wide solid-liquid two phase zone. The surface segregation formation cannot be explained by the traditional solidification theories. ProCAST software was used to simulate the TZCC process for preparing the Cu-4.7 wt%Sn alloy with wide solid-liquid two phase zone. The Sn solute distribution in TZCC Cu-4.7 wt%Sn alloy was investigated, and the surface segregation mechanism of TZCC Cu-4.7 wt%Sn alloy was analyzed. The results showed that numerical simulation results were agreed with that of experimental. TZCC Cu-4.7 wt%Sn alloy in the center firstly started to solidify and resulted in "A" shape inclined solid/liquid (S/L) interface near the mold. Therefore, a narrow gap between the wall of the two-phase zone mold and the S/L interface formed. On the one hand, while Cu-4.7 wt%Sn alloy solidified along the opposite continuous casting direction, the solute redistribution between the solid and the liquid occurred, which lead to Sn solute decreased in solid and enriched in front of S/L interface. Because the narrow gap lies in front of inclined S/L interface near the two-phase zone mold, Sn solute enriches in liquid of the narrow gap. On the other hand, during the TZCC process, solid grains nucleate on the wall of the two-phase zone mold, while the melt feeds into the two-phase zone mold which the temperature is in the two-phase zone of the Cu-4.7 wt%Sn alloy. The solute redistribution also occurs while the solid grains grow, thus lead to Sn content increases in front of S/L interface near the wall of the two-phase zone mold. The enriched Sn solute is too late to diffuse, and will quickly flows into the narrow gap, resulting in further increasing of Sn content in the narrow gap. The liquid with enriched Sn solute in the narrow gap will become the surface layer after solidification, which lead to surface segregation layer during the TZCC Cu-4.7 wt%Sn alloy.
机译:具有宽固液两相区的两相区连铸(TZCC)合金中存在表面偏析。传统的凝固理论不能解释表面偏析的形成。用ProCAST软件模拟TZCC工艺制备具有宽固液两相区的Cu-4.7 wt%Sn合金。研究了TZCC Cu-4.7 wt%Sn合金中锡的溶质分布,分析了TZCC Cu-4.7 wt%Sn合金的表面偏析机理。结果表明,数值模拟结果与实验结果吻合。中心的TZCC Cu-4.7 wt%Sn合金首先开始凝固,并在模具附近形成“ A”形倾斜的固/液(S / L)界面。因此,在两相区域模具的壁和S / L界面之间形成了狭窄的间隙。一方面,当Cu-4.7 wt%Sn合金沿相反的连续铸造方向凝固时,固溶体和液相之间发生溶质再分布,导致Sn溶质在固体中减少并富集在S / L界面的前面。由于窄间隙位于两相区模具附近的倾斜S / L界面的前面,因此Sn溶质会富集窄间隙的液体。另一方面,在TZCC过程中,固体颗粒在两相区模具的壁上成核,而熔体进入温度在Cu-4.7的两相区中的两相区模具中。 wt%Sn合金。当固相晶粒长大时,也会发生溶质的重新分布,从而导致在两相区模具壁附近的S / L界面前面的Sn含量增加。富集的Sn溶质为时已晚,无法扩散,会迅速流入狭窄的缝隙中,导致狭窄缝隙中Sn含量进一步增加。狭窄间隙中富含Sn溶质的液体在凝固后将成为表面层,这在TZCC Cu-4.7 wt%Sn合金过程中导致表面偏析层。

著录项

  • 来源
    《Materials science forum》 |2016年第2016期|610-617|共8页
  • 作者单位

    School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;

    School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China,State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China,Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, China;

    School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;

    School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Two-phase zone continuous casting; Cu-Sn alloy; Surface Sn segregation; Numerical simulation;

    机译:两相区连铸;铜锡合金;表面锡偏析;数值模拟;

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