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Physical Aspects of the Liquid Zones Thermomigration Method for Formation of Electronic Technics Materials with the Required Substructure

机译:形成具有所需子结构的电子技术材料的液体区热迁移方法的物理方面

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摘要

The paper analyzes the features of a liquid zones thermomigration process in a crystal for the formation of semiconductor materials with the required substructure, carried out in comparison with a diffusion method. The primary factors defining and accompanying the thermomigration process of liquid inclusion in a crystal are considered. The geometrical, concentration, temperature-time and other conditions at which the choice of the thermomigration effect as a local doping method is preferable are revealed and described. It is shown, that the thermomigration method possesses considerable advantages, in particular, the possibilities of decreasing doping process temperature, increasing process speed, increasing the distribution uniformity of the doping impurity and improves the crystal perfection of the doped layers. The quantitative estimations related to the revealed conditions, are illustrated with an aluminium-silicon example.
机译:与扩散法相比,本文分析了晶体中液体区热迁移过程的特征,以形成具有所需子结构的半导体材料。考虑了定义并伴随晶体中液体的热迁移过程的主要因素。揭示并描述了优选选择热迁移效应作为局部掺杂方法的几何形状,浓度,温度-时间和其他条件。结果表明,热迁移法具有相当大的优势,特别是可以降低掺杂工艺温度,提高工艺速度,提高掺杂杂质的分布均匀性并改善掺杂层的晶体完整性。以铝硅为例说明了与揭示的条件有关的定量估计。

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  • 来源
    《Materials science forum 》 |2016年第2016期| 145-150| 共6页
  • 作者单位

    Platov South-Russian State Polytechnic University (NPI), St. Prosvescheniya, 132, Rostov region, Novocherkassk, 346428, Russian Federation;

    Platov South-Russian State Polytechnic University (NPI), St. Prosvescheniya, 132, Rostov region, Novocherkassk, 346428, Russian Federation;

    Platov South-Russian State Polytechnic University (NPI), St. Prosvescheniya, 132, Rostov region, Novocherkassk, 346428, Russian Federation;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    thermomigration effect; diffusion; doping; semiconductor structures; power silicon devices;

    机译:热迁移效应扩散;掺杂半导体结构;功率硅器件;

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