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Plasma Printing of Micro-Punch Assembly for Micro-Embossing of Aluminum Sheets

机译:用于铝板微压花的微打孔组件的等离子印刷

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This paper concerned with micro-embossing of micro-cavities and micro-grooves into aluminum sheets by CNC-stamping with use of the arrayed DLC multi-punches. Both SKD11 and AISI420 steel die substrates were prepared and DLC-coated with the thickness of 10 to 15 μm. This DLC coating worked as a punch material. The two dimensional micro-patterns were printed onto this DLC film by maskless lithography. The unprinted DLC films were removed by the plasma oxidation to leave the three dimensional DLC-punch array on the steel substrate. This micro-pillared and micro-grooved DLC-punches were placed into the cassette die set for micro-embossing process by using the table-top CNC stamper. The micro-circular patterns transformed to the micro-pillars in the DLC punch by the plasma oxidation. Through the CNC-micro-embossing, this micro-texture further transferred to micro-cavities in the aluminum sheet. The dimensional accuracy of embossed micro-textures by stamping was measured by SEM and three dimensional profilometer with comparison to the tailored micro-pattern and the DLC-punch array configuration.
机译:本文涉及通过使用阵列式DLC多冲头通过CNC冲压将微腔和微沟槽压制成铝板的微压花。制备了SKD11和AISI420钢模具基底,并对其进行了DLC涂层,厚度为10至15μm。该DLC涂层用作冲压材料。通过无掩模光刻将二维微图案印刷到该DLC膜上。通过等离子氧化去除未印刷的DLC膜,从而在钢基材上留下三维DLC打孔阵列。通过使用台式CNC压模,将此微柱状和微沟槽DLC冲孔放入盒式模具中,以进行微压纹处理。通过等离子体氧化,微圆形图案转变为DLC打孔器中的微柱。通过CNC微压花,该微纹理进一步转移到铝板上的微腔中。与定制的微图案和DLC打孔阵列配置相比,通过SEM和三维轮廓仪测量通过压印压纹的微纹理的尺寸精度。

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