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首页> 外文期刊>Materials Science and Engineering. B, Solid-State Materials for Advanced Technology >SiGe-on-insulator material fabrication by oxygen implantation into SiGe/Si heterostructure and novel two-step annealing
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SiGe-on-insulator material fabrication by oxygen implantation into SiGe/Si heterostructure and novel two-step annealing

机译:通过向SiGe / Si异质结构中注入氧和新颖的两步退火工艺制造绝缘体上SiGe材料

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摘要

Relaxed SiGe-on-insulator (SGOI) is an attractive material to fabricate strained Si structures. Separation-by-implantation-of-oxygen (SIMOX) is a competing method to synthesize SGOI materials. In this work, pseudomorphic SiGe grown directly on Si substrate without any buffer layer SiGe/Si were implanted with 3 x 10~(17) cm~(-2) oxygen ions at 60 kV followed by thermal treatment. Our results show that the sample structure strongly depends on the thermal history. Ge diffusions mainly occur at the beginning stage of the high temperature process. Oxygen segregation and Ge diffusion during the annealing process were investigated using Rutherford backscattering spectroscopy/channeling, high-resolution X-ray diffraction, and high-resolution transmission electron microscopy. We introduce a novel two-step annealing process to reduce Ge loss during the high temperature annealing. Sharp interfaces and good crystal quality SGOI structure was obtained. Our results indicate that the SIMOX process for silicon-on-insulator (SOI) fabrication can be adopted to produce SGOI.
机译:绝缘体上弛豫硅锗(SGOI)是制造应变硅结构的一种有吸引力的材料。氧植入法(SIMOX)是合成SGOI材料的竞争方法。在这项工作中,在60 kV的电压下注入3 x 10〜(17)cm〜(-2)氧离子,在没有任何缓冲层SiGe / Si的情况下直接在Si衬底上生长的拟晶SiGe进行热处理。我们的结果表明,样品的结构在很大程度上取决于热历史。 Ge扩散主要发生在高温过程的开始阶段。使用卢瑟福背散射光谱/通道,高分辨率X射线衍射和高分辨率透射电子显微镜研究了退火过程中的氧偏析和Ge扩散。我们介绍了一种新颖的两步退火工艺,以减少高温退火过程中的Ge损耗。获得了清晰的界面和良好的晶体质量SGOI结构。我们的结果表明,可以采用SIMOX绝缘体上硅(SOI)制造工艺来生产SGOI。

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