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An indentation method to measure the CRSS of semiconducting materials at elevated temperature

机译:一种在高温下测量半导体材料CRSS的压痕方法

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摘要

An indentation method that allows to determine the critical resolved shear stress (CRSS) of semiconductors as a function of temperature is described. Specimens have to be thinned in such a way, that plastic flow throughout the thickness is generated. Assuming mechanical equilibrium allows to extract the CRSS from the plastic-zone perimeter evolution with changing load. At elevated temperature, we have estimated the thermal gradient in the specimens between the diamond tip and the heating stage and its influence on the local mechanical properties. The map of the temperature around the indent site allows to define an average CRSS of the material which is successfully compared with our experimental results.
机译:描述了一种压痕方法,该方法可以确定半导体的临界分辨剪切应力(CRSS)作为温度的函数。样品必须以这种方式变薄,以便在整个厚度范围内产生塑性流动。假设机械平衡允许在载荷变化的情况下从塑性区周长演变中提取CRSS。在升高的温度下,我们已经估计出了金刚石尖端和加热阶段之间的样品中的热梯度及其对局部机械性能的影响。压痕位置周围的温度图可以定义材料的平均CRSS,并将其与我们的实验结果成功进行比较。

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