...
机译:用于电子应用的含Fe的Sn-1Ag-0.5Cu焊料合金的组织,力学和热性能
Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia;
Department of Electrical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia;
Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia;
Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia;
Institute of Microelectronics, A'STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore;
Sn-1Ag-0.5Cu alloy; fe addition; mechanical properties; microstructure properties; thermal properties;
机译:电子用Sn-1Ag-0.5Cu锡合金含Al的组织和拉伸性能
机译:电子用Sn-1Ag-0.5Cu锡合金含Al的组织和拉伸性能
机译:铁和铋的添加对Sn-1Ag-0.5Cu钎料合金的组织,力学和热性能的影响
机译:高温退火下添加0.1wt。%Al的Sn-1Ag-0.5Cu焊料合金的组织稳定性和力学性能
机译:电子封装应用中的Sn-Ag-Cu无铅焊料的机械性能和微观结构研究。
机译:热处理工艺对Ti-22Al-25Nb烧结合金组织演变和力学性能的影响
机译:PB焊料和Sn-Ag-Cu系列焊料合金焊接性能与机械热疲劳性能的比较。
机译:微观结构对钛合金力学性能的影响:微观结构对含α-溶剂添加剂的钛锰合金力学性能的影响