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机译:铜基合金化SnBi / Cu接头的界面组织和力学性能
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China, Capital Aerospace Machinery Company, Beijing 100076, PR China;
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China;
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, PR China;
Sn-Bi solder; Cu_3Sn; void; bi segregation; interfacial embrittlement; cu alloys;
机译:通过使Cu基体合金化来消除SnBi / Cu接头中铋的界面偏析和脆化
机译:Cu / Sn-0.7Cu-xNi / Cu钎焊接头的组织,界面IMC层及力学性能的研究
机译:石墨烯包覆的Cu基体上Sn58Bi焊点的界面反应,微观结构和力学性能
机译:冷却速度对Cu基体上Sn-Ag-Cu无铅焊点组织和力学性能的影响
机译:Cu和Cu-Zn合金的显微组织和力学性能。
机译:多重回流对Sn-0.5Cu-Al(Si)焊料和Cu基质的界面反应和力学性能的影响
机译:界面反应对3003 Al / T2 Cu和1035 Al / T2 Cu钎焊关节的微观结构和力学性能的影响
机译:等通道角挤压制备大块纳米Cu-Ta合金的组织与力学性能。